TDA8783HLBE-T Datasheet, PDF (23/28 Pages) NXP Semiconductors – 40 Msps, 10-bit analog-to-digital interface for CCD cameras

Philips Semiconductors
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
PACKAGE OUTLINE
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
Product specification
TDA8783
SOT313-2
c
y
X
36
37
25
A
24 Z _E
48
1
e
pin 1 index
wM
b_p
D
HD
e
wM
b_p
13
E ^HE
12
ZD
vM A
B
vM B
A
A₂
A₁
(A ₃)
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max. A₁ A₂ A₃ b_p
c D⁽¹⁾ E⁽¹⁾ e
H_D H_E L
L_p
v
w
y Z_D ⁽¹⁾ Z_E ⁽¹⁾ θ
mm
1.60
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
7.1
6.9
0.5
9.15
8.85
9.15
8.85
1.0
0.75
0.45
0.2
0.12
0.1
0.95 0.95
0.55 0.55
7^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT313-2
IEC
136E05
REFERENCES
JEDEC
EIAJ
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
00-01-19
2002 Oct 23
23