GTL2008 Datasheet, PDF (22/22 Pages) NXP Semiconductors – 12-bit GTL to LVTTL translator with power good control and high-impedance LVTTL and GTL outputs

NXP Semiconductors
GTL2008
GTL translator with power good control and high-impedance outputs
20. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 5
7.1
Function tables . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
Application design-in information . . . . . . . . . . 7
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
10
Recommended operating conditions. . . . . . . . 8
11
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
12.1
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13
Test information . . . . . . . . . . . . . . . . . . . . . . . . 14
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
15
Soldering of SMD packages . . . . . . . . . . . . . . 16
15.1
Introduction to soldering . . . . . . . . . . . . . . . . . 16
15.2
Wave and reflow soldering . . . . . . . . . . . . . . . 16
15.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
15.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17
16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
18.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
18.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
19
Contact information. . . . . . . . . . . . . . . . . . . . . 21
20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 19 February 2010
Document identifier: GTL2008_4