74HC259 Datasheet, PDF (2/21 Pages) NXP Semiconductors – 8-bit addressable latch

NXP Semiconductors
74HC259; 74HCT259
8-bit addressable latch
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
N CDM JESD22-C101C exceeds 1000 V
I Multiple package options
I Specified from −40 °C to +85 °C and from −40 °C to +125 °C
3. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name
74HC259N
−40 °C to +125 °C DIP16
74HCT259N
74HC259D
−40 °C to +125 °C SO16
74HCT259D
74HC259DB
−40 °C to +125 °C SSOP16
74HCT259DB
74HC259PW −40 °C to +125 °C TSSOP16
74HCT259PW
74HC259BQ
−40 °C to +125 °C DHVQFN16
74HCT259BQ
Description
plastic dual in-line package; 16 leads (300 mil)
Version
SOT38-4
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
plastic shrink small outline package; 16 leads; body SOT338-1
width 5.3 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
plastic dual in-line compatible thermal enhanced very SOT763-1
thin quad flat package; no leads; 16 terminals;
body 2.5 × 3.5 × 0.85 mm
4. Functional diagram
14
LE
Q0 ⁴
13 _D
Q1 ⁵
Q2 ⁶
7
Q3
1 _A0
9
Q4
2 _A1
Q5 ¹⁰
3 _A2
11
Q6
12
Q7
MR
15 mna573
Fig 1. Logic symbol
13
Z9
15
G8
14
G10
DX
9,10D
4
1
0
1
C10
8R
0
2
3
G
0
7
1
2
5
6
2
7
3
9
4
10
5
11
6
12
7
mna572
Fig 2. IEC logic symbol
74HC_HCT259_4
Product data sheet
Rev. 04 — 25 February 2009
© NXP B.V. 2009. All rights reserved.
2 of 21