JN5148-001M03T534 Datasheet, PDF (14/23 Pages) NXP Semiconductors – JenNet, ZigBee PRO and IEEE802.15.4 Module

A.3 Manufacturing
A.3.1 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste
manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates.
Temperature
Target Time (s)
25~160 ºC
160~190 ºC
> 220º C
230~Pk.
90~130
30~60
20~50
10~15
Figure 6: Recommended solder reflow profile
Pk. Temp
(235ºC)
150~270
A.3.2 Soldering Paste and Cleaning
Jennic would not recommend use of a solder paste that requires the module and pcb assembly to be cleaned (rinsed
in water) for the following reasons:
Solder flux residues and water can be trapped by the pcb, can or components and result in short circuits.
The module label could be damaged or removed.
Jennic recommends use of a 'no clean' solder paste for all its module products.
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JN-DS-JN5148-001-Myy 1v4
© NXP Laboratories UK 2010