GTL2003 Datasheet, PDF (13/19 Pages) NXP Semiconductors – 8-bit bidirectional low voltage translator

NXP Semiconductors
GTL2003
8-bit bidirectional low voltage translator
14. Package outline
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
y
Z
20
c
11
E
A
X
H_E
vM A
pin 1 index
1
e
10
wM
b_p
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾
e
H_E
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT360-1
MO-153
L
L_p
Q
v
w
y
Z ⁽¹⁾ θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.5
0.2
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT360-1 (TSSOP20)
GTL2003_1
Product data sheet
Rev. 01 — 27 July 2007
© NXP B.V. 2007. All rights reserved.
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