GTL2009 Datasheet, PDF (12/17 Pages) NXP Semiconductors – 3-bit GTL Front-Side Bus frequency comparator

Philips Semiconductors
GTL2009
3-bit GTL Front-Side Bus frequency comparator
14. Package outline
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
c
y
Z
16
9
E
A
X
H_E
vM A
pin 1 index
1
e
8
wM
b_p
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾
e
H_E
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT403-1
MO-153
L
L_p
Q
v
w
y
Z ⁽¹⁾ θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.40
0.06
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 12. Package outline SOT403-1 (TSSOP16)
9397 750 13556
Product data sheet
Rev. 01 — 22 September 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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