28F800C3 Datasheet, PDF (69/70 Pages) Intel Corporation – Advanced+ Boot Block Flash Memory (C3)

C3 Discrete
Appendix E Ordering Information
Figure 23: Component Ordering Information
T E2 8 F 3 2 0 C3 T C7 0
Package
TE = 48- Lead TSOP
GT = 48- Ball µBGA * CSP
GE = VF BGA CSP
RC = Easy BGA
PC = Pb Free Easy BGA
PH = Pb Free VFBGA
JS = Pb Free TSOP
Product line designator
for all Inte^®l Flash products
Device Density
640 = x16 (64 Mbit)
320 = x16 (32 Mbit)
160 = x16 (16 Mbit)
800 = x16 (8 Mbit)
Access Speed (ns)
(70, 80 , 90, 100 , 110 )
Lithography
A = 0.25 µm
C = 0.18 µm
D = 0.13 µm
T = Top Blocking
B = Bottom Blocking
Product Family
C3 = 3 Volt Advanced+ Boot Block
VCC = 2.7 V–3.6 V
VPP = 2 .7 V–3 .6 V or
1.14 V–12 .6 V
March 2008
290645-24
Datasheet
69