LP39542 Datasheet, PDF (56/58 Pages) National Semiconductor (TI) – Advanced Lighting Management Unit

Physical Dimensions inches (millimeters) unless otherwise noted
The dimension for X1 ,X2 and X3 are as given:
— ^{X1=3.00 mm ±0.03 mm}
— ^{X2=3.00 mm ±0.03 mm}
— ^{X3=0.60 mm ±0.075 mm}
36-bump micro SMD Package, 3 x 3 x 0.6 mm, 0.5 mm pitch
NS Package Number TLA36AAA
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