LP3936 Datasheet, PDF (4/20 Pages) National Semiconductor (TI) – Lighting Management System for Six White LEDs and One RGB or FLASH LED

Absolute Maximum Ratings (Notes 1,
2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V_DD1, V_DD2, V_{DD_IO}, V(OUT, FB)
Voltage on Logic Pins
Voltage on LED Output Pins
Voltage on All Other Pins
I (ROUT, GOUT, BOUT)
I (V_REF)
Continuous Power Dissipation
(Note 3)
Junction Temperature (T_J-MAX)
Storage Temperature Range
-0.3V to 6.0V
-0.3V to V_{DD_IO} +
0.3V, with 6.0V max
-0.3V to V(FB) +
0.3V, with 6.0V max
-0.3V to V_DD1,2 +
0.3V, with 6.0V max
150 mA
10 µA
Internally Limited
125˚C
−65˚C to +150˚C
Maximum Lead Temperature
(Reflow soldering, 3 times) (Note 4)
ESD Rating (Note 5)
Human Body Model:
Machine Model:
260˚C
2 kV
200V
Operating Ratings (Notes 1, 2)
V_DD1, V_DD2
V_{DD_IO}
Recommended Load Current
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range
(Note 6)
3.0V to 6.0V
1.8V – V_DD1,2
0 mA to 250 mA
−40˚C to +125˚C
−40˚C to +85˚C
Thermal Properties
Junction-to-Ambient Thermal Resistance (θ_JA),
SLD32A Package (Note 7)
72˚C/W
Electrical Characteristics (Notes 2, 8)
Limits in standard typeface are for T_J = 25˚C. Limits in boldface type apply over the operating ambient temperature range
(−40˚C ≤ T_A ≤ +85˚C). Unless otherwise noted, specifications apply to the Section Block Diagram with: V_DD1 = V_DD2 = V_{DD_IO}
= 3.6V, C_VDD1, C_VDD2, C_VDDIO = 1 µF, C_IN, C_OUT = 10 µF, C_VDDA = 1 µF, C_VREF = 0.1 µF, L_BOOST = 10 µH (Note 9).
Symbol
Parameter
Condition
Min
Typ
Max
Units
V_DD1,2
I_DD
Supply Voltage
Standby Supply Current
(V_DD1 and V_DD2 current)
No-Load Supply Current
NSTBY = L (register)
CS, SCL, DI, NRST = H
V_DD1, V_DD2 = 3.6V
NSTBY = H (reg.)
3.0
3.6
6.0
V
1
7
µA
170
300
µA
(V_DD1 and V_DD2 current, boost off)
EN_BOOST = L (reg.)
SCL, CS, DI, NRST = H
Full Load Supply Current
NSTBY = H (register)
1
mA
(V_DD1 and V_DD2 current, boost on)
NRST, CS, SCL, DI = H
RGB_EN = L
WLED1 … 6 = L
EN_AMBADC = L
I_{DD_IO}
V_{DD_IO} Standby Supply Current
NSTBY = L (register)
CS, SCL, DI, NRST = H
1
µA
V_REF
V_DDA
V_{DD_IO} Operating Supply Current
Reference Voltage (Note 10)
LDO Output Voltage
1 MHz Clock Frequency
C_L = 50 pF at DO pin
I_REF ≤ 1 nA,
Test Purposes Only
IV_DDA < 1 µA
20
µA
1.205
1.23
1.255
V
−2
+2
%
2.688
2.8
2.912
%V
–4
+4
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pins (GND1, GND2, GND_T, GND_BOOST, GND_WLED, GND_RGB).
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160˚C (typ.) and disengages at T_J =
140˚C (typ.).
Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1125: Laminate CSP/FBGA
Package (AN-1125).
Note 5: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
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