English
Language : 

DS90LV804_07 Datasheet, PDF (4/10 Pages) National Semiconductor (TI) – 4-Channel 800 Mbps LVDS Buffer/Repeater
Symbol
Parameter
Conditions
LVDS OUTPUT DC SPECIFICATIONS (OUTn±)
VOD
ΔVOD
Differential Output Voltage (Note RL = 100Ω external resistor between OUT+ and
6)
OUT−
Change in VOD between
Complementary States
VOS
ΔVOS
Offset Voltage (Note 7)
Change in VOS between
Complementary States
IOS
Output Short Circuit Current
COUT2 Output Capacitance
SUPPLY CURRENT (Static)
OUT+ or OUT− Short to GND
OUT+ or OUT− to GND when TRI-STATE
ICC
Total Supply Current
All inputs and outputs enabled and active,
terminated with external differential load of 100Ω
between OUT+ and OUT-.
ICCZ
TRI-STATE Supply Current
EN = 0V
SWITCHING CHARACTERISTICS—LVDS OUTPUTS
tLHT
Differential Low to High
Transition Time
tHLT
Differential High to Low
Transition Time
Use an alternating 1 and 0 pattern at 200 Mbps,
measure between 20% and 80% of VOD. (Note
12)
tPLHD
tPHLD
Differential Low to High
Propagation Delay
Differential High to Low
Propagation Delay
Use an alternating 1 and 0 pattern at 200 Mbps,
measure at 50% VOD between input to output.
tSKD1
tSKCC
Pulse Skew
|tPLHD–tPHLD| (Note 12)
Output Channel to Channel Skew Difference in propagation delay (tPLHD or tPHLD)
among all output channels. (Note 12)
tSKP
Part to Part Skew
Common edge, parts at same temp and VCC(Note
12)
tJIT
Jitter
(Note 8)
RJ - Alternating 1 and 0 at 400 MHz (Note 9)
DJ - K28.5 Pattern, 800 Mbps (Note 10)
TJ - PRBS 223-1 Pattern, 800 Mbps (Note 11)
tON
LVDS Output Enable Time
Time from EN to OUT± change from TRI-STATE to
active.
tOFF
LVDS Output Disable Time
Time from EN to OUT± change from active to TRI-
STATE.
Min
250
−35
1.05
−35
Typ
(Note 5)
Max
500 600
35
1.18 1.475
35
−60 −90
5.5
117 140
2.7
6
210 300
210 300
2.0
3.2
2.0
3.2
25
80
50
125
1.1
1.1
1.5
15
35
30
55
300
12
Units
mV
mV
V
mV
mA
pF
mA
mA
ps
ps
ns
ns
ps
ps
ns
psrms
psp-p
psp-p
ns
ns
Note 5: Typical parameters are measured at VDD = 3.3V, TA = 25°C. They are for reference purposes, and are not production-tested.
Note 6: Differential output voltage VOD is defined as ABS(OUT+–OUT−). Differential input voltage VID is defined as ABS(IN+–IN−).
Note 7: Output offset voltage VOS is defined as the average of the LVDS single-ended output voltages at logic high and logic low states.
Note 8: Jitter is not production tested, but guaranteed through characterization on a sample basis.
Note 9: Random Jitter, or RJ, is measured RMS with a histogram including 1500 histogram window hits. The input voltage = VID = 500mV, 50% duty cycle at 400
MHz, tr = tf = 50ps (20% to 80%).
Note 10: Deterministic Jitter, or DJ, is measured to a histogram mean with a sample size of 350 hits. The input voltage = VID = 500mV, K28.5 pattern at 800
Mbps, tr = tf = 50ps (20% to 80%). The K28.5 pattern is repeating bit streams of (0011111010 1100000101).
Note 11: Total Jitter, or TJ, is measured peak to peak with a histogram including 3500 window hits. Stimulus and fixture Jitter has been subtracted. The input
voltage = VID = 500mV, 223-1 PRBS pattern at 800 Mbps, tr = tf = 50ps (20% to 80%).
Note 12: Not production tested. Guaranteed by statistical analysis on a sample basis at the time of characterization.
www.national.com
4