THS4631 Datasheet, PDF (3/34 Pages) Texas Instruments – HIGH-VOLTAGE, HIGH SLEW RATE, WIDEBAND FET-INPUT OPERATIONAL AMPLIFIER

THS4631
www.ti.com
SLOS451B – DECEMBER 2004 – REVISED AUGUST 2011
PACKAGE DEVICES⁽¹⁾
THS4631D
THS4631DR
THS4631DDA
THS4631DDAR
THS4631DGN
THS4631DGNR
PACKAGE / ORDERING INFORMATION
PACKAGE TYPE SOIC – 8
SOIC – 8
SOIC-PP – 8⁽²⁾
MSOP-PP – 8⁽²⁾
TRANSPORT MEDIA, QUANTITY
Rails, 75
Tape and Reel, 2500
Rails, 75
Tape and Reel, 2500
Rails, 100
Tape and Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) PowerPad™ is electrically isolated from all other pins. Connection of the PowerPAD to the PCB ground plane is recommended because
the ground plane is typically the largest copper area on a PCB. However, connection of the PowerPAD to V_S- up to V_S+ is allowed if
desired.
PIN ASSIGNMENTS
TOP VIEW
THS4631
D, DDA, AND DGN
NC 1
8
NC
V_IN−
2
7
V_S+
V_IN+
3
6
V_{OUT −}
V_S−
4
5
NC
NC = No Internal Connection
Copyright © 2004–2011, Texas Instruments Incorporated
3