THS4631 Datasheet, PDF (2/34 Pages) Texas Instruments – HIGH-VOLTAGE, HIGH SLEW RATE, WIDEBAND FET-INPUT OPERATIONAL AMPLIFIER

THS4631
SLOS451B – DECEMBER 2004 – REVISED AUGUST 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_S
V_I
I_O ⁽²⁾
T_J
T_A
T_stg
Supply voltage, V_S– to V_S+
Input voltage
Output current
Continuous power dissipation
Maximum junction temperature⁽²⁾
Operating free-air temperature, continues operation, long-term reliability⁽²⁾
Storage temperature range
HBM
ESD ratings:
CDM
MM
UNITS
33 V
±V_S
150 mA
See Dissipation Rating Table
150°C
125°C
–65°C to 150°C
1000 V
1500 V
100 V
(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
PACKAGE DISSIPATION RATINGS
PACKAGE
D (8)⁽²⁾
DDA (8)
DGN (8)
θ_JC (°C/W)
38.3
9.2
4.7
θ_JA (°C/W)
95
45.8
58.4
POWER RATING⁽¹⁾ (T_J =125°C)
T_A ≤ 25°C
T_A = 85°C
1.1 W
0.47 W
2.3 W
0.98 W
2.14 W
1.11 W
(1) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance.
(2) This data was taken using the JEDEC standard High-K test PCB.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
V_S
Supply Voltage
Dual Supply
Single Supply
T_A
Operating free-air temperature
MIN
MAX UNITS
±5
±15
V
10
30
-40
85
°C
2
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