LMH6552_14 Datasheet, PDF (2/32 Pages) Texas Instruments – 1.5 GHz Fully Differential Amplifier

LMH6552
SNOSAX9H – APRIL 2007 – REVISED MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾
ESD Tolerance ⁽²⁾
Human Body Model
Machine Model
Supply Voltage
Common Mode Input Voltage
Maximum Input Current (pins 1, 2, 7, 8)
Maximum Output Current (pins 4, 5)
Maximum Junction Temperature
Soldering Information
For soldering specifications see SNOA549C
2000V
200V
13.2V
±V_S
30 mA
(3)
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) Human Body Model, applicable std. MIL-STD-883, Method 30157. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3) The maximum output current (I_OUT) is determined by device power dissipation limitations. See POWER DISSIPATION of Application
Information for more details.
Operating Ratings ⁽¹⁾
Operating Temperature Range ⁽²⁾
Storage Temperature Range
Total Supply Voltage
Package Thermal Resistance (θ_JA)
8-Pin SOIC
8-Pin WSON
−40°C to +85°C
−65°C to +150°C
4.5V to 12V
150°C/W
58°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX)– T_A) / θ_JA. All numbers apply for packages soldered directly onto a PC Board.
2
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