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BUK7506-55A Datasheet, PDF (2/15 Pages) NXP Semiconductors – TrenchMOS standard level FET
Philips Semiconductors
BUK7506-55A; BUK7606-55A
TrenchMOS™ standard level FET
5. Quick reference data
Table 2: Quick reference data
Symbol Parameter
VDS
ID
Ptot
Tj
RDSon
drain-source voltage (DC)
drain current (DC)
total power dissipation
junction temperature
drain-source on-state resistance
6. Limiting values
Conditions
Tmb = 25 °C; VGS = 10 V
Tmb = 25 °C
VGS = 10 V; ID = 25 A
Tj = 25 °C
Tj = 175 °C
Typ
−
[1] −
−
−
5.3
−
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VDS
VDGR
VGS
ID
drain-source voltage (DC)
drain-gate voltage (DC)
gate-source voltage (DC)
drain current (DC)
RGS = 20 kΩ
Tmb = 25 °C; VGS = 10 V;
Figure 2 and 3
IDM
peak drain current
Ptot
total power dissipation
Tstg
storage temperature
Tj
operating junction temperature
Source-drain diode
IDR
reverse drain current (DC)
Tmb = 100 °C; VGS = 10 V; Figure 2
Tmb = 25 °C; pulsed; tp ≤ 10 µs;
Figure 3
Tmb = 25 °C; Figure 1
Tmb = 25 °C
IDRM
pulsed reverse drain current
Avalanche ruggedness
WDSS non-repetitive avalanche energy
Tmb = 25 °C; pulsed; tp ≤ 10 µs
unclamped inductive load; ID = 75 A;
VDS ≤ 55 V; VGS = 10 V; RGS = 50 Ω;
starting Tmb = 25 °C
[1] Current is limited by power dissipation chip rating
[2] Continuous current is limited by package
Min
−
−
−
[1] −
[2] −
[2] −
−
−
−55
−55
[1] −
[2]
−
−
Max Unit
55
V
154
A
300
W
175
°C
6.3
mΩ
13.2 mΩ
Max Unit
55
V
55
V
±20
V
154
A
75
A
75
A
616
A
300
W
+175 °C
+175 °C
154
A
75
A
616
A
1.1
J
9397 750 08421
Product data
Rev. 02 — 03 July 2001
© Philips Electronics N.V. 2001. All rights reserved.
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