LMC8101TP Datasheet, PDF (18/19 Pages) National Semiconductor (TI) – Rail-to-Rail Input and Output, 2.7V Op Amp in micro SMD package with Shutdown

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION”. IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com)
3. RECOMMENDED NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD (Lead Free) Package
Order Package Number LMC8101TP, or LMC8101TPX
NS Package Number TPA08FFA
X₁ = 1.412 mm X₂ = 1.412 mm X₃ = 0.5 mm
www.national.com
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