LMC8101TP Datasheet, PDF (17/19 Pages) National Semiconductor (TI) – Rail-to-Rail Input and Output, 2.7V Op Amp in micro SMD package with Shutdown

Physical Dimensions inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMENDED NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD Package
Order Package Number LMC8101BP, LMC8101BPCONV or LMC8101BPX
NS Package Number BPA08FFB
X₁ = 1.412 X₂ = 1.412 X₃ = 0.850
17
www.national.com