PIP202-12M-2 Datasheet, PDF (17/20 Pages) NXP Semiconductors – DC-to-DC converter powertrain

Philips Semiconductors
PIP202-12M-2
DC-to-DC converter powertrain
1 SP
(8×) _{0.4 SP}
0.6 Cu
0.4 SP
0.28 Cu (68×)
1 SP
(8×)
11.15 OA 7.6 Cu _4.1
(2×)
(2×)
0.6 Cu
0.4 SP (2×)
e = 0.5
8.9 Cu 10.8 Cu
(2×) (2×)
0.5 SP
(4×)
0.9 SP
(10×)
4.1
8.63 OA
(4×)
1 SP
(10×)
MGW820
solder lands
0.1
Cu pattern
0.2
clearance
solder paste
0.025
All dimensions in mm.
Fig 20. PCB footprint for SOT687-1 package (reflow soldering).
occupied area
16.2 Solder paste printing
The process of printing the solder paste requires care because of the fine pitch and
small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The
stencil apertures can be made the same size as the PCB lands in Figure 20.
The type of solder paste recommended for MLF packages is “No clean”, Type 3, due
to the difficulty of cleaning flux residues from beneath the MLF package.
9397 750 11943
Product data
Rev. 02 — 24 November 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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