PIP202-12M-2 Datasheet, PDF (14/20 Pages) NXP Semiconductors – DC-to-DC converter powertrain

Philips Semiconductors
PIP202-12M-2
DC-to-DC converter powertrain
14. Package outline
HVQFN68: plastic thermal enhanced very thin quad flat package; no leads;
68 terminals; body 10 x 10 x 0.85 mm
D
B
D1
A
terminal 1
index area
SOT687-1
E1 E
A
A4
A1
c
detail X
18
L
17
Eh1
Eh1
e1
e
b
34
vM C A B
wM C
35
e
Eh e2
y1 _C
C
y
1
51
terminal 1 ₆₈
52
index area
Dh
Dh
0
2.5
5 mm
X
DIMENSIONS (mm are the original dimensions)
scale
UNIT
A
max.
A1
A4
b
c
D D1 Dh E
E1 Eh Eh1 e
e1 e2
L
vw
y y1
mm
1
0.05 0.80 0.30
0.00 0.65 0.18
0.2
10.15 9.95
9.85 9.55
3.8 10.15 9.95 7.85
3.5 9.85 9.55 7.55
3.8
3.5
0.5
8
8
0.75
0.50
0.1
0.05 0.05
0.1
OUTLINE
VERSION
IEC
SOT687-1
---
REFERENCES
JEDEC
JEITA
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-18
03-06-13
Fig 17. SOT687-1.
9397 750 11943
Product data
Rev. 02 — 24 November 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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