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PC87373 Datasheet, PDF (161/174 Pages) National Semiconductor (TI) – LPC SuperI/O with Glue Functions
13.0 Device Characteristics (Continued)
13.4.3 Clock Timing
High-Frequency Clock Timing
Symbol Figure Clock Input Parameters
Reference
Conditions
CLOCKI14
Min
Typ
Max
Units
tCH
tCL
tCP
FCK
tCR
tCF
t14MW
t14MVAL
51 Clock High Pulse Width1
29.5
ns
51 Clock Low Pulse Width1
29.5
ns
51 Clock Period1 (50%-50%)
69.14
69.84
70.54
ns
− Clock Frequency
FCKTYP − 1% 14.31818 FCKTYP + 1% MHz
51 Clock Rise Time1 (20%-80%)
52
ns
51 Clock Fall Time1 (80%-20%)
52
ns
52 Clock Wake-Up Time
VDD3 stable to clock
start toggling
System dependent
52 Clock Valid Time1
Clock start toggling
to clock valid
System dependent
1. Not tested. Guaranteed by design.
2. Recommended value
Sym. Fig. Internal Clock Parameter
Reference
Conditions
tCP 51 Clock Period1 (50%-50%)
FCK − Clock Frequency
t48MD 52 Clock Wake-Up Time1
After Clock
Generator enabled
1. Not tested. Guaranteed by characterization.
INT48M
Min
Typ
Max
20.83
48
500
Units
ns
MHz
µs
tCH
tCP
VIH
VIH
VIH
VIL
VIL
VIL
tCL
tCF
tCR
Figure 51. High-Frequency Clock Waveform Timing
VDD3 (Power) VDD3ONmin
t14MW
t14MVAL
tCP (CLOCKI14)
CLOCKI14
(14.31818 MHz)
Enable Clock Generator
(Internal)
CKVALID bit
(Internal)
48 MHz Domain
(Internal)
t48MD
tCP (48 MHz)
Figure 52. CLOCKI14 and Internal 48 MHz Domain Timing
Revision 1.1
161
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