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LP3929 Datasheet, PDF (11/12 Pages) National Semiconductor (TI) – High Speed Bi-Directional Level Shifter and Ultra Low-Dropout CMOS Voltage Regulator and Line
Application Information
EXTERNAL CAPACITORS
Like any low-dropout regulator, the LP3929 requires external
capacitors for regulator stability. The LP3929 is specifically
designed for portable applications requiring minimum board
space and smallest components. These capacitors must be
correctly selected for good performance.
INPUT CAPACITOR
An input capacitance of 1 µF is required between the
LP3929 VBAT pin and ground (the amount of the capacitance
may be increased without limit).
This capacitor must be located a distance of not more than
1 cm from the VBAT pin and returned to a clean analog
ground. Any good quality ceramic, tantalum, or film capacitor
may be used at the input.
Important: Tantalum capacitors can suffer catastrophic fail-
ures due to surge current when connected to a low-
impedance source of power (like a battery or a very large
capacitor). If a tantalum capacitor is used at the input, it must
be guaranteed by the manufacturer to have a surge current
rating sufficient for the application.
There are no requirements for the ESR on the input capaci-
tor, but tolerance, bias voltage and temperature coefficient
must be considered when selecting the capacitor to ensure
the capacitance will be 1 µF over the entire operating con-
ditions.
FAST ON-TIME
The LP3929 utilizes a speed up circuitry to ramp up the
internal VREF voltage to its final value to achieve a fast
output turn on time.
CAPACITOR CHARACTERISTICS
The LP3929 is designed to work with ceramic capacitors on
the output to take advantage of the benefits they offer: for
capacitance values in the range of 1 µF to 4.7 µF range,
ceramic capacitors are the smallest, least expensive and
have the lowest ESR values (which makes them best for
eliminating high frequency noise). The ESR of a typical 1 µF
ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which
easily meets the ESR requirement for stability by the
LP3929.
The ceramic capacitor’s capacitance can vary with tempera-
ture.
Most large value ceramic capacitors (2.2 µF) are manufac-
tured with Z5U or Y5V temperature characteristics, which
results in the capacitance dropping by more than 50% as the
temperature goes from 25˚C to 85˚C.
A better choice for temperature coefficient in ceramic capaci-
tor is X7R, which holds the capacitance within ±15%.
Tantalum capacitors are less desirable than ceramic for use
as output capacitors because they are more expensive when
comparing equivalent capacitance and voltage ratings in the
1 µF to 4.7 µF range.
Another important consideration is that tantalum capacitors
have higher ESR values than equivalent size ceramics. This
means that while it may be possible to find a tantalum
capacitor with an ESR value within the stable range, it would
have to be larger in capacitance (which means bigger and
more costly) than a ceramic capacitor with the same ESR
value. It should also be noted that the ESR of a typical
tantalum will increase about 2:1 as the temperature goes
from 25˚C down to −40˚C, so some guard band must be
allowed.
OUTPUT CAPACITOR
The LP3929 is designed specifically to work with very small
ceramic output capacitors, any ceramic capacitor (dielectric
types Z5U, Y5V or X7R) in 1.0 µF to 2.2 µF range with 5 mΩ
to 500 mΩ ESR range is suitable in the LP3929 application
circuit.
It may also be possible to use tantalum or film capacitors at
the output, but these are not as attractive for reasons of size
and cost (see section Capacitor Characteristics).
The output capacitor must meet the requirement for mini-
mum amount of capacitance and also have an ESR (Equiva-
lent Series Resistance) value which is within a stable range.
The output capacitor should be placed as near as possible to
the VDDB pin.
NO-LOAD STABILITY
The LDO of the LP3929 will remain stable and in regulation
with no external load connected to the LDO output VDDB.
This is especially important in CMOS RAM keep-alive appli-
cations.
MICRO SMD ASSEMBLY
For assembly recommendations of micro SMD package
please refer to National Semiconductor Application Note
AN-1112.
MICRO SMD LIGHT SENSITIVITY
Exposing the micro SMD device to direct sunlight will cause
misoperation of the device. Light sources such as Halogen
lamps can effect electrical performance if brought near to the
device.
The wavelengths which have most detrimental effect are
reds and infra-reds, which means that the fluorescent light-
ing used inside most buildings has very little effect on
performance.
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