LMC7111 Datasheet, PDF (11/18 Pages) National Semiconductor (TI) – Tiny CMOS Operational Amplifier with Rail-to-Rail Input

10V PERFORMANCE (Continued)
Sourcing Output vs
Output Voltage
Sinking Output vs
Output Voltage
Gain and Phase vs
Capacitive Load @ 10V
DS012352-56
Gain and Phase vs
Capacitive Load @ 10V
DS012352-57
Gain and Phase vs
Capacitive Load @ 10V
DS012352-58
Non-Inverting Small Signal
Pulse Response at 10V
DS012352-59
Non-Inverting Large Signal
Pulse Response at 10V
DS012352-60
Inverting Small Signal
Pulse Response at 10V
DS012352-61
Inverting Large Signal
Pulse Response at 10V
DS012352-62
DS012352-63
DS012352-64
Application Information
1.0 Benefits of the LMC7111
Tiny Amp
Size. The small footprint of the SOT 23-5 packaged Tiny
amp, (0.120 x 0.118 inches, 3.05 x 3.00 mm) saves space on
printed circuit boards, and enable the design of smaller elec-
tronic products. Because they are easier to carry, many cus-
tomers prefer smaller and lighter products.
Height. The height (0.056 inches, 1.43 mm) of the Tiny amp
makes it possible to use it in PCMCIA type III cards.
Signal Integrity. Signals can pick up noise between the sig-
nal source and the amplifier. By using a physically smaller
amplifier package, the Tiny amp can be placed closer to the
signal source, reducing noise pickup and increasing signal
integrity. The Tiny amp can also be placed next to the signal
destination, such as a buffer for the reference of an analog to
digital converter.
Simplified Board Layout. The Tiny amp can simplify board
layout in several ways. First, by placing an amp where amps
are needed, instead of routing signals to a dual or quad de-
vice, long pc traces may be avoided.
By using multiple Tiny amps instead of duals or quads, com-
plex signal routing and possibly crosstalk can be reduced.
DIPs available for prototyping. LMC7111 amplifiers pack-
aged in conventional 8-pin dip packages can be used for
prototyping and evaluation without the need to use surface
mounting in early project stages.
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