NSPG346KS Datasheet, PDF (6/16 Pages) NICHIA CORPORATION – RoHS Compliant

SOLDERING
• Hand Soldering
Temperature
Soldering Time
Position
350°C Max.
3 sec. Max.
No closer than 2mm from
the base of the lens.
NICHIA STS-DA1-1352 <Cat.No.110117>
• Dip Soldering
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
120°C Max.
60 sec. Max.
260°C Max.
10 sec.Max
No closer than 2mm from
the base of the lens.
* Solder the LED no closer than 2 mm from the base of the lens. Soldering beyond the base of the tie bar is recommended.
* Dip soldering and manual soldering must only be done once.
* A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
* Do not apply any stress to the lead particularly when heated.
* After soldering, the LED position must not be corrected.
* After soldering, NO mechanical shock or vibration should be applied to LED lens until the LEDs cool down
to room temperature.
* In order to avoid damage on the lens during cutting and clinching the leads, it is not recommended to solder
the LEDs directly on customer PCB without any gap between the lens and the board. If it is unavoidable,
customer is advised to check whether such soldering will not cause wire breakage or lens damage.
Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the lens.
* When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress
on the LEDs.
* Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.
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