NSPG346KS Datasheet, PDF (14/16 Pages) NICHIA CORPORATION – RoHS Compliant

CAUTIONS
NICHIA STS-DA1-1352 <Cat.No.110117>
(1) Lead Forming
● When forming leads, the leads should be bent at a point at lease 3mm from the base of the epoxy bulb.Do not use
the base of the leadframe as a fulcrum during lead forming.
● Lead forming should be done before soldering.
● Do not apply any bending stress to the base of the lead. The stress to the base may damage the LED's characteristics or
it may break the LEDs.
● When mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned
with the lead pitch of the product.If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin
and this will degrade the LEDs.
(2) Storage
● Shelf life of the products in unopened bag is 3 months (max.) at <30°C and 70% RH from the delivery date.If the shelf life
exceeds 3 months or more, the LEDs need to be stored in a sealed container with desiccant (silica gel) to ensure
their shelf life will not exceed 1 year.
● Customer is advised to store properly the products in controlled ambient and complete immediately all high temperature
related process including soldering as exposure to corrosive environment might cause the plated metal parts of the product
to tarnish, which might lead to difficulties in soldering.
● To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.
(3) Directions for Use
● In designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating specified for each LED.
It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile,
when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
● This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected to
either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product,
such operation can cause migration resulting in LED damage.
● For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or higher.
● Care must be taken to ensure that the reverse voltage will not exceed the Absolute Maximum Rating when using the LEDs
with matrix drive.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
(4) Handling Precautions
● When handling the product, do not touch it directly with bare hands as it may contaminate the surface and affect
on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure due to
package damage and/or wire breakage.
● If the product is dropped, it might be damaged.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.
(5) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to brake.
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not with hands.
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