NSSU100C Datasheet, PDF (5/16 Pages) NICHIA CORPORATION – SPECIFICATIONS FOR UV LED

SOLDERING
NICHIA STS-DA1-1793 <Cat.No.110530>
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
260°C Max
10sec Max
• Recommended Manual Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
120sec Max
● Recommended Soldering Pad Pattern
1.5
4.4
(単位 Unit: mm)
* The product is designed to be reflow soldered to a PCB. If you use dip soldering for the products,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Manual soldering must only be done once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation
due to the heat and atmosphere of reflow soldering.
* Since silicone used as encapsulating resin in this product is a soft material, do not press on the encapsulant.
Failure to comply might lead to nicks, chip-outs, delamination and deformation of the encapsulant, wire breakage
and an adverse effect on product reliability.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, avoid applying any stress to the LED package while heated.
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