NSSU100C Datasheet, PDF (15/16 Pages) NICHIA CORPORATION – SPECIFICATIONS FOR UV LED

NICHIA STS-DA1-1793 <Cat.No.110530>
(3) Handling Precautions
● When handling the product, do not touch it directly with bare hands as it may contaminate the surface
and affect on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure
due to package damage and/or wire breakage.
● When handling the product with tweezers, make sure that excessive force is not applied to the resin portion of the product.
Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed,
and wire to be broken, and thus resulting in catastrophic failure.
● If the product is dropped, it might be damaged.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.
(4) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break.
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not with hands.
● If an aluminum PCB is used, customer is advised to verity the PCB with the products before use.
Thermal stress during use can cause the solder joints to crack.
(5) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. An ESD event may damage its die
or reduce its reliability performance. When handling the products, measures against electro static discharge,
including the followings, are strongly recommended.
Eliminating the charge;
Wrist strap, ESD footwear and garments, ESD floors
Grounding the equipment and tools at workstation
ESD table/shelf mat (conductive materials)
● Proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products.
Also note that surge protection should be considered in the design of customer products.
● If tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge,
including the followings, are strongly recommended.
Dissipating the charge with conductive materials
Preventing the charge generation with moisture
Neutralizing the charge with ionizers
● When performing the characteristics inspection of the LEDs in your application, customer is advised to check on the LEDs
whether or not they are damaged by ESD. Such damage can be detected during forward voltage measurement at low current.
(the recommended current is 1mA or lower)
● ESD-damaged LEDs may have a current flow at low voltage.
Failure Criteria: V_F<2.0V at I_F=0.5mA
(6) Thermal Management
● Thermal management is an important factor when designing your product by using the LEDs.
The rise in LED die temperature can be affected by PCB thermal resistance or/and LED spacing as mounted on the board.
Customer is advised to design the product to ensure that the LED die temperature
does not exceed the required maximum Junction Temperature (T_J).
● Drive current should be determined for the surrounding ambient temperature (T_A) to dissipate the heat from the product.
(7) Cleaning
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
● Ultrasonic cleaning is not recommended for the LEDs since it may adversely effect on the LEDs
by the ultrasonic power and LED assembled condition.
If it is unavoidable, customer is advised to check prior to use that the cleaning will not damage the LEDs.
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