UPD78320 Datasheet, PDF (78/88 Pages) NEC – 16/8-BIT SINGLE-CHIP MICROCONTROLLER

µPD78320, 78322
11. RECOMMENDED SOLDERING CONDITIONS
The µPD78322 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document “Semiconductor Device Mounting
Technology Manual” (IE-1207).
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 11-1. Soldering Conditions for Surface Mount Type
µPD78320GF-3B9
: 80-pin plastic QFP (14 × 20 mm)
µPD78322GF-×××-3B9 : 80-pin plastic QFP (14 × 20 mm)
µPD78320GJ-5BJ
: 74-pin plastic QFP (20 × 20 mm)
µPD78322GJ-×××-5BJ : 74-pin plastic QFP (20 × 20 mm)
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Pin part heating
Package peak temperature: 235 °C, Time: 30 sec. max. (at 210 °C or above),
Number of times: twice or less
<Caution>
(1) The second reflow should be started after the temperature of the device which
would have been changed by the first reflow has returned to normal.
(2) Please avoid flux water washing after the first reflow.
Package peak temperature: 215 °C, Time: 40 sec. max. (at 200 °C or above),
Number of times: twice or less
<Caution>
(1) The second reflow should be started after the temperature of the device which
would have been changed by the first reflow has returned to normal.
(2) Please avoid flux water washing after the first reflow.
Solder bath temperature: 260 °C max. Time: 10 sec. max., Number of times: Once
Preheating temperature: 120 °C max. (package surface temperature)
Pin temperature: 300 °C max. Time: 3 sec. max. (Per device side)
Recommended
Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
µPD78320L
: 68-pin plastic QFJ ( 950 mil)
µPD78322L-××× : 68-pin plastic QFJ ( 950 mil)
Soldering Method
Infrared reflow
VPS
Pin part heating
Soldering Conditions
Recommended
Condition Symbol
Package peak temperature: 230 °C, Time: 30 sec. max. (at 210 °C or above),
Number of times: Once
Package peak temperature: 215 °C, Time: 40 sec. max. (at 200 °C or above),
Number of times: Once
Pin part temperature: 300 °C max. Time: 3 sec. max. (Per device side)
IR30-00-1
VP15-00-1
Caution Use more than one soldering method should be avoided (except in the case of pin part heating).
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