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UPG132G Datasheet, PDF (13/14 Pages) NEC – L-BAND SPDT SWITCH | |||
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µPG132G
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions
than the recommended conditions are to be consulted with our sales representatives.
[µPG132G]
Soldering process
Infrared ray reflow
VPS
Wave Soldering
Pin part heating
Soldering conditions
Package peak temperature: 230 ËC
Hour: within 30 s. (more than 210 ËC)
Time: 2 time, Limited days: no.Note
Package peak temperature: 215 ËC
Hour: within 40 s. (more than 200 ËC),
Time: 2 time, Limited days: no.Note
Soldering tub temperature: less than 260 ËC, Hour: within 10 s.
Time: 1 time, Limited days: no.Note
Pin area temperature: less than 300 ËC, Hour: within 10 s.
Limited days: no.Note
Recommended condition
symbol
IR30-00-2
VP15-00-2
WS60-00-1
Note It is the storage days after opening a dry pack, the storage conditions are 25 ËC, less than 65 %, RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535EJ7V0IF00).
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