EXB28V Datasheet, PDF (8/10 Pages) Nais(Matsushita Electric Works) – Chip Resistor Array

Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Part No.
EXB28V
Spec. No.
151-EXB-28V02DE
9-8
1. Application Range
This specification covers taping specification of EXB28V Type.
2. Physical Dimensions
2-1. Stracture and reel dimensions shall be as shown in the figure below.
11.4±1.0
Unit:mm
Carrier Tape(Paper)
Top Tape
Adhesive Tape
2-2. Carrier Tape Dimensions
P0
φD0
P2
P1
9.0±1.0
Sprocket hole
T
(mm)
A
Chip hole
Chip resistor array
A
B
W
F
1.20±0.05 2.20±0.10 8.00±0.20 3.50±0.05
E
1.75±0.10
(mm)
P1
P2
P0
T
φD0
2.00±0.10 2.00±0.05 4.00±0.10 0.52±0.05 1.50^+00.10
3. Specification
3-1.Taping
When the test shall be operated with the below conditions, peel strength should be 0.049N to
0.49N, should not have flash and tear after peeling.
<Test Method>
Carrier Tape
Peeling Direction
10°
Top Tape
•Minimum Bending Radius
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip and
no break of carrier tape. However minimum bending radius shall be tested for 1 times.
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.