EXB28V Datasheet, PDF (3/10 Pages) Nais(Matsushita Electric Works) – Chip Resistor Array

Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Part No.
EXB28V
Spec. No.
151-EXB-28V02DE
9-3
As far as there shall be not designation especially, the following test and measurement shall be
operated under normal temperature(5 °C to 35 °C), normal humidity(45 %RH to 85 %RH),
normal atmospheric pressure(86 kPa to 106 kPa).
6. Performance Specification
Item
DC resistance
Temperature
coefficient
Overload
Intermittent
overload
Dielectric
Withstanding
Insulation
Resistance
Specification
Resistor
Jumper
Test methods
DC resistance value shall be Measuring voltage: refer to JIS-C5201-1
within the specified tolerance At 20 °C, 65 %RH
Resistance
< 10Ω
10Ω to 1MΩ
TCR
+600
−100
×10^-6
/
°C
±200 ×10^-6 / °C
±(2 %+0.1 Ω)
Less than
50 mΩ
Natural resistance change per temperature
degree centigrade.
TCR=
R₂ - R₁
R₁×(t₂ - t₁)
R₁ : Resistance value at reference
temperature(t₁)
R₂ : Resistance value at test
temperature(t₂)
t₂ - t₁ = 100 °C, t₁ = 25 °C
Resistors shall be applied 2.5 times the rated
voltage for 5 seconds.
Maximum over load voltage shall be 100 V.
Resistors shall be subjected to 10000 cycles of
±(5 %+0.1 Ω)
Less than
50 mΩ
2.5 times the rated voltage applied for 1
second with pause of 25 seconds between
tests.
Maximum over load voltage shall be 100 V
No evidence of flashover,
AC 100V between substrate and termination
mechanical damage, arcing or for 1 minute.
insulation breakdown.
Min. 1,000 MΩ
Insulation resistance between substrate and
termination shall be measured at DC 100V.
7. Mechanical characteristic
Item
Specification
Resistor
Jumper
Test methods
Terminal strength min. 4.9N
Copper plate: t=0.4 mm
Pull speed: 10 mm/s
Bend strength
the face plating
of ^{No mechanical damage}
±(1 %+0.05 Ω)
Less than
50 mΩ
Substrate: Glass epoxy(t = 1.6 mm)
Span: 90 mm
Bending distance: 3 mm (10 seconds)
Solderability
Termination should be
uniformly with solder.
(min. 95 % coverage)
covered
Resistors shall
bath at 235 °C
be
±5
dipped in
°C for 2 s
the melted solder
± 0.5 s. Flux shall
be removed from the surface of termination
with clean organic solvent.
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.