GCM32ER71A226KE12L Datasheet, PDF (61/67 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
C03E.pdf
May.17,2013
Notice
4. Flux Application
1. An excessive amount of flux generates a large quantity of
flux gas, which can cause a deterioration of solder ability,
so apply flux thinly and evenly throughout. (A foaming
system is generally used for flow soldering.)
2. Flux containing too high a percentage of halide may
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.1%
max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux
including wash-type flux and non-wash-type flux.)
5. Flow Soldering
o Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
[As a Single Chip]
A
B
D
C
Outer Electrode
[As Mounted on Substrate]
B
A
6. Washing
1. Please evaluate the capacitor using actual cleaning
equipment and conditions to confirm the quality, and
select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or
other foreign substances, causing deterioration of
electrical characteristics and the reliability of the
capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or
insufficient) may result in deterioration of the
performance of the capacitors.
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