GCM32ER71A226KE12L Datasheet, PDF (46/67 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
For Automotive
!Caution/Notice
C03E.pdf
May.17,2013
!Caution
Notice
c Storage and Operation Conditions ^{..........................} 45
c Rating ^{......................................................................} 45
1. Temperature Dependent Characteristics............. 45
2. Measurement of Capacitance.............................. 46
3. Applied Voltage ^{...................................................} 46
4. Type of Applied Voltage and
Self-heating Temperature.................................... 47
5. DC Voltage and AC Voltage Characteristics ^....... 48
6. Capacitance Aging ^{..............................................} 49
7. Vibration and Shock ^{............................................} 49
c Soldering and Mounting ^{..........................................} 49
1. Mounting Position ^{................................................} 49
2. Information before Mounting................................ 50
3. Maintenance of the Mounting
(pick and place) Machine..................................... 50
4-1. Reflow Soldering ^{..............................................} 51
4-2. Flow Soldering.................................................. 52
4-3. Correction with a Soldering Iron ^{.......................} 53
4-4. Leaded Component Insertion ^{...........................} 54
5. Washing............................................................... 54
6. Electrical Test on Printed Circuit Board............... 54
7. Printed Circuit Board Cropping............................ 54
8. Selection of Conductive Adhesive,
Mounting Process, and Bonding Strength ^........... 56
9. Moisture Proof Process ^{.......................................} 56
10. Application ^{.........................................................} 56
c Rating ^{......................................................................} 57
1. Operating Temperature ^{.......................................} 57
2. Atmosphere Surroundings................................... 57
3. Piezo-electric Phenomenon................................. 57
c Soldering and Mounting ^{..........................................} 57
1. PCB Design ^{.........................................................} 57
1. Notice for Pattern Forms ^{.................................} 57
2. Land Dimensions............................................. 58
2. Adhesive Application ^{...........................................} 58
3. Adhesive Curing ^{..................................................} 59
4. Flux Application ^{...................................................} 59
5. Flow Soldering..................................................... 59
6. Washing............................................................... 59
7. Coating ^{................................................................} 60
c Other ^{.......................................................................} 60
1. Transportation ^{.....................................................} 60
2. Characteristics Evaluation
in the Actual System............................................ 60
c Other ^{.......................................................................} 56
1. Under Operation of Equipment............................ 56
2. Other.................................................................... 56
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