GCM32ER71A226KE12L Datasheet, PDF (51/67 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C03E.pdf
May.17,2013
Continued from the preceding page.
6. Capacitance Aging
1. The high dielectric constant type capacitors have the
characteristic in which the capacitance value decreases
with the passage of time.
When you use high dielectric constant type capacitors in
a circuit that needs a tight (narrow) capacitance tolerance
(e.g., a time-constant circuit), please carefully consider
the characteristics of these capacitors, such as their
aging, voltage, and temperature characteristics. In
addition, check capacitors using your actual appliances at
the intended environment and operating conditions.
!Caution
[Example of Change Over Time (Aging Characteristics)]
20
10
0
-10
-20
-30
-40
10
100
1000
Time (h)
C0G
X7R
10000
7. Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its
condition, and any generation of resonance.
Please mount the capacitor so as not to generate
resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause
damage or a crack in the dielectric material of the
capacitor.
Do not use a dropped capacitor because the quality and
reliability may be deteriorated.
3. When printed circuit boards are piled up or handled, the
corner of another printed circuit board should not be
allowed to hit the capacitor, in order to avoid a crack or
other damage to the capacitor.
Floor
Crack
Mounting printed circuit board
Crack
c Soldering and Mounting
1. Mounting Position
1. Confirm the best mounting position and direction that
minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1. Choose a mounting position that minimizes the
stress imposed on the chip during flexing or bending
of the board.
[Component Direction]
Locate chip
horizontal to the
direction in
which stress
acts.
[Chip Mounting Close to Board Separation Point]
Perforation
C
B
D
A
Slit
Stress is easily
imposed in the order of
B, D<C<A.
Continued on the following page.
49