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MTD2N50E Datasheet, PDF (5/10 Pages) Motorola, Inc – TMOS POWER FET 2.0 AMPERES 500 VOLTS RDS(on) = 3.6 OHM | |||
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18
450
16
ID = 2 A
TJ = 25°C
400
14
350
12
10
8 Q1
6
QT
300
250
VGS
200
Q2
150
4
100
2
50
Q3
0
VDS
0
0 1 2 3 4 5 6 7 8 9 10
QG, TOTAL GATE CHARGE (nC)
Figure 8. GateâToâSource and DrainâToâSource
Voltage versus Total Charge
100
VDD = 250 V
ID = 2 A
VGS = 10 V
TJ = 25°C
td(off)
10
tf
td(on)
tr
MTD2N50E
1
1
10
100
RG, GATE RESISTANCE (OHMS)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
DRAINâTOâSOURCE DIODE CHARACTERISTICS
2.0
VGS = 0 V
1.6
TJ = 25°C
1.2
0.8
0.4
0
0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85
VSD, SOURCEâTOâDRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drainâtoâsource voltage and
drain current that a transistor can handle safely when it is for-
ward biased. Curves are based upon maximum peak junc-
tion temperature and a case temperature (TC) of 25°C. Peak
repetitive pulsed power limits are determined by using the
thermal response data in conjunction with the procedures
discussed in AN569, âTransient Thermal ResistanceâGener-
al Data and Its Use.â
Switching between the offâstate and the onâstate may tra-
verse any load line provided neither rated peak current (IDM)
nor rated voltage (VDSS) is exceeded and the transition time
(tr,tf) do not exceed 10 µs. In addition the total power aver-
aged over a complete switching cycle must not exceed
(TJ(MAX) â TC)/(RθJC).
A Power MOSFET designated EâFET can be safely used
in switching circuits with unclamped inductive loads. For reli-
able operation, the stored energy from circuit inductance dis-
sipated in the transistor while in avalanche must be less than
the rated limit and adjusted for operating conditions differing
from those specified. Although industry practice is to rate in
terms of energy, avalanche energy capability is not a con-
stant. The energy rating decreases nonâlinearly with an in-
crease of peak current in avalanche and peak junction
temperature.
Although many EâFETs can withstand the stress of drainâ
toâsource avalanche at currents up to rated pulsed current
(IDM), the energy rating is specified at rated continuous cur-
rent (ID), in accordance with industry custom. The energy rat-
ing must be derated for temperature as shown in the
accompanying graph (Figure 12). Maximum energy at cur-
rents below rated continuous ID can safely be assumed to
equal the values indicated.
Motorola TMOS Power MOSFET Transistor Device Data
5
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