MRF166W Datasheet, PDF (3/6 Pages) Motorola, Inc – TMOS BROADBAND RF POWER FET

RF INPUT
A
R2
R1 C14
R7
D1 _C22
A
T1
C21
C13
C2 Z2 ^L1 _Z3
R4
R3
C23
L3 _Z5
C3
C4
C5
Z6
C1 Z1 ^L2 Z4 ^L4
R5
R6
A
C20
C12
B
RFC1
C15
C16
RFC2
VDD _{28 V}
+
C17 ⁺ _C18
–
Vdc
–
C10
Z7
Z8 C8
T2
D.U.T.
C6
C7
Z9
Z10 ^C9
C11
RFC3
B
C19
RF OUTPUT
L3, L4
0.065″
L1, L2 _0.116″
0.265″
0.455″
C1, C2, C8, C9,
C12, C13, C15
C3
C4
C5
C6
C7
C10, C11, C14, C19,
C20, C21, C22
C16, C17
C18
C23
D1
L1, L2
L3, L4
270 pF, Chip Cap
5.6 pF, Chip Cap
20 pF, Chip Cap
0 – 20 pF, Johanson*
8.2 pF, Chip Cap
15 pF, Chip Cap
0.01 µF
680 pF, Feedthru
10 µF, 50 V
0 – 10 pF, Johanson*
IN5343 – Motorola Zener
Hair Pin Inductor #18 AWG,
0.065 W x 0.265 H
Hair Pin Inductor #18 AWG,
0.116 W x 0.445 H
RFC1
RFC2, RFC3
R1
R2
R3, R6
R4 R5
R7
T1, T2
Z1, Z2
Z3, Z4
Z5, Z6
Z7, Z9
Z8, Z10
Ferroxcube VK–200–19/4B
10T, ID = 1/4″, 18 AWG
10 kΩ, 10T
9.2 kΩ, 1/2 W
330 Ω, 1.0 W
520 Ω, 1/4 W
1.5 kΩ, 1/2 W
Balun 2.0″, 50 Ω Semi–Rigid Coax
0.120 x 0.467″
0.120 x 0.55″ *
0.120 x 0.49″
0.120 x 0.85″
0.120 x 0.6″ for C6
* C4, C5 Center of Z3 and Z4
Board Material – Teflon^® Fiberglass
Dielectric Thickness = 0.030″, ε_r = 2.55 Copper Clad, 2.0 oz. Copper
Figure 1. MRF166 400 MHz Test Circuit Schematic
MOTOROLA RF DEVICE DATA
MRF166W
3