MCM63F837 Datasheet, PDF (27/28 Pages) Motorola, Inc – 256K x 36 and 512K x 18 Bit Flow–Through BurstRAM Synchronous Fast Static RAM

Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
4X
0.20 (0.008) H A–B D
80
81
–D–
–A–
TQ PACKAGE
TQFP
CASE 983A–01
2X 30 TIPS
0.20 (0.008) C A–B D
51
50
E/2
–B–
E1 E
100
31
1
D1/2
D1
D
30
D/2
2X 20 TIPS
0.20 (0.008) C A–B D
E1/2
A
–H–
–C–
SEATING
PLANE
0.05 (0.002) S
S
A2
q2
0.10 (0.004) C
q3
VIEW AB
q1
0.25 (0.010)
R2
GAGE PLANE
A1
R1
L2
L
q
L1
VIEW AB
e
e/2
B
B
VIEW Y
–X–
X=A, B, OR D
BASE
METAL
PLATING
c^{ÇÇÇÉÉÇÇÇÉÉÇÇÇÉÉbb1 ÇÇÇÉÉ} c1
0.13 (0.005) M C A–B S D S
SECTION B–B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS D1 AND B1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE b DIMENSION TO EXCEED 0.45
(0.018).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A ––– 1.60 ––– 0.063
A1 0.05 0.15 0.002 0.006
A2 1.35 1.45 0.053 0.057
b 0.22 0.38 0.009 0.015
b1 0.22 0.33 0.009 0.013
c 0.09 0.20 0.004 0.008
c1 0.09 0.16 0.004 0.006
D 22.00 BSC
0.866 BSC
D1 20.00 BSC
0.787 BSC
E 16.00 BSC
0.630 BSC
E1 14.00 BSC
0.551 BSC
e
0.65 BSC
0.026 BSC
L 0.45 0.75 0.018 0.030
L1 1.00 REF
0.039 REF
L2
0.50 REF
0.020 REF
S 0.20 ––– 0.008 –––
R1 0.08 ––– 0.003 –––
R2 0.08 0.20 0.003 0.008
q
0_{_} 7_{_} 0_{_} 7_{_}
q1
0_{_} –––
0_{_} –––
q2 11_ 13_ 11_ 13_
q3 11_ 13_ 11_ 13_
MOTOROLA FAST SRAM
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MCM63F837•MCM63F919
27