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URA2405LD-15WR2 Datasheet, PDF (3/9 Pages) MORNSUN Science& Technology Ltd. – DUAL/SINGLE OUTPUT DIP PACKAGING, DC-DC CONVERTER
Size
Weight
PCB mounting(Without heat sink)
PCB mounting(With heat sink)
A2S Chassis mounting(Without heat sink)
A2S Chassis mounting(With heat sink)
A4S DIN-Rail mounting(Without heat sink)
A4S DIN-Rail mounting(With heat sink)
PCB mounting(Without heat sink)
PCB mounting(With heat sink)
A2S Chassis mounting(Without heat sink)
A2S Chassis mounting(With heat sink)
A4S DIN-Rail mounting(Without heat sink)
A4S DIN-Rail mounting(With heat sink)
50.80×25.40×11.80
50.80×25.40×16.30
76.00×31.50×21.20
mm
76.00×31.50×25.10
76.00×31.50×25.80
76.00×31.50×29.70
--
28
--
--
36
--
--
50
--
g
--
58
--
--
70
--
--
78
--
ENVIRONMENTAL SPECIFICATIONS
Item
Test Conditions
Storage Humidity
Non condensing
Operating Temperature
See Temperature Derating Curve(Figure 3)
Storage Temperature
The Max. Case Temperature
Operating Temperature curve range
Lead Temperature
1.5mm from case for 10 seconds
Cooling
Vibrating
Min.
Typ.
Max.
Unit
5
--
95
%
-40
--
85
-55
--
125
°C
--
--
105
--
--
300
Free air convection
10-55Hz, 10G, 30 Min. along X, Y and Z
EMC SPECIFICATIONS
CE
EMI
RE
ESD
RS
EFT
EMS
Surge
CS
Voltage dips、short
and interruptions
immunity
CISPR22/EN55022 CLASS A(Without External Circuit)/ CLASS B(External Circuit Refer to Figure1-②)
CISPR22/EN55022 CLASS A(Without External Circuit)/ CLASS B(External Circuit Refer to Figure1-②)
IEC/EN61000-4-2 Contact ±4KV
perf. Criteria B
IEC/EN61000-4-3 10V/m
perf. Criteria A
IEC/EN61000-4-4 ±2KV(External Circuit Refer to Figure1-①)
IEC/EN61000-4-5 ±2KV(External Circuit Refer to Figure1-①)
perf. Criteria B
perf. Criteria B
IEC/EN61000-4-6 3 Vr.m.s
perf. Criteria A
IEC/EN61000-4-29 0%-70%
perf. Criteria B
EMC RECOMMENDED CIRCUIT
V in
GND
FU S E
MOV
LDM1
LDM2
+
C1
TVS C0
①
②
C Y1
Vin
+Vo
EUT
LOAD
GND
C Y2
-Vo
(0V)
(Figure 1)
Note: 1.In Figure 1,part ①is EMS recommended external circuit, part ②is EMI
recommended external circuit. Choose according to requirements.
Recommended external circuit parameters:
Model
Vin:24V
Vin:48V
FUSE
Choose according to practical input current
MOV
S14K35
S14K60
LDM1
56μH
TVS
SMCJ48A
SMCJ90A
C0
330μF/50V
330μF/100V
C1
1μF /50V
1μF /100V
LDM2
4.7μH
CY1、CY2
1nF /2KV
EMC RECOMMENDED CIRCUIT PCB LAYOUT
(Figure 2)
Note: The pad space between input and output (CY1/CY2) must ≥2mm.
The copyright and authority for the interpretation of the products are reserved by MORNSUN
URA_LD-15WR2 & URB_LD-15WR2 2013.11.29-A/3 Page 3of 9