PS22056_12 Datasheet, PDF (5/9 Pages) Mitsubishi Electric Semiconductor – Dual-In-Line Package Intelligent Power Module

MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS22056
TRANSFER-MOLD TYPE
INSULATED TYPE
MECHANICAL CHARACTERISTICS AND RATINGS
Parameter
Mounting torque
Weight
Heat-sink flatness
Condition
Limits
Unit
Min.
Typ.
Max.
Mounting screw : M4
Recommended 1.18 N·m 0.98
—
1.47 N·m
—
77
—
g
(Note 6) –50
—
100
µm
Note 6: Measurement point of heat-sink flatness
+–
Heat-sink side
Measurement location
3.25mm
–
+
Heat-sink side
RECOMMENDED OPERATION CONDITIONS
Symbol
Parameter
Condition
Limits
Min.
Typ.
VCC
Supply voltage
Applied between P-NU, NV, NW
350
600
VD
Control supply voltage
Applied between VP1-VPC, VN1-VNC
13.5 15.0
VDB
Control supply voltage
Applied between VUFB-VUFS, VVFB-VVFS, VWFB-VWFS
13.5 15.0
∆VD, ∆VDB Control supply variation
–1
—
tdead
fPWM
Arm shoot-through blocking time For each input signal, TC ≤ 100°C
PWM input frequency
TC ≤ 100°C, Tj ≤ 125°C
3.3
—
—
—
VCC = 600V, VD = 15V, fC = 15kHz
IO
Allowable r.m.s. current
P.F = 0.8, sinusoidal PWM
—
—
Tj ≤ 125°C, TC ≤ 100°C
(Note 7)
PWIN(on)
(Note 8) 1.5
—
350 ≤ VCC ≤ 800V,
13.5 ≤ VD ≤ 16.5V,
Ic ≤ 25A
2.1
—
Minimum input pulse width
PWIN(off)
13.5 ≤ VDB ≤ 16.5V,
–20°C ≤ TC ≤ 100°C,
N line wiring inductance less than
25 < Ic ≤ 42.5A
2.3
—
10nH
(Note 9)
VNC
VNC variation
Between VNC-NU, NV, NW (including surge)
–5.0
—
Note 7 : The output r.m.s. current value depends on the actual application conditions.
8 : DIP-IPM might not make response to the input on signal with pulse width less than PWIN (on).
9 : DIP-IPM might not make response or work properly if the input off signal pulse width is less than PWIN (off).
Max.
800
16.5
16.5
1
—
15
9.2
—
—
—
5.0
Unit
V
V
V
V/µs
µs
kHz
Arms
µs
V
May 2005