English
Language : 

PS22056_12 Datasheet, PDF (1/9 Pages) Mitsubishi Electric Semiconductor – Dual-In-Line Package Intelligent Power Module
PS22056
MITMSUITBSIUSBHISSHEIMSIECMOINCDOUNCDTUOCRTO<DRu<aDl-uIna-lL-Iinn-eLiPnaecPkacgkeaIgneteIlnlitgeellnigt ePnotwPeorwMeordMuoled>ule>
PS22PS02526056
TRATNRSAFNESRF-EMRO-MLDOLTDYPTEYPE
INSIUNLSAUTLEADTETDYPTEYPE
INTEGRATED POWER FUNCTIONS
1200V/25A low-loss 4th generation IGBT inverter bridge
for 3 phase DC-to-AC power conversion
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS
• For upper-leg IGBTS :Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection.
• For lower-leg IGBTS : Drive circuit, Control supply under-voltage protection (UV), Short circuit protection (SC).
• Fault signaling : Corresponding to an SC fault (Lower-side IGBT) or a UV fault (Lower-side supply).
• Input interface : 5V line CMOS/TTL compatible (High active logic).
APPLICATION
AC400V 0.2kW~3.7kW inverter drive for small power motor control.
Fig. 1 PACKAGE OUTLINES
Dimensions in mm
2.54±0.3
30✕2.54(=76.2)
12
34
56
78
9 10 11 12 13 14 15 16 17 18 19 20 21
Type name , Lot No.
2-φ4.5±0.2
QR
Code
22
23
24
25
26
27
28
8±0.3
10.16±0.3
67±0.3
79±0.5
Heat sink side
A
(2.5)
Heat sink side
(2)
Detail : A
All external terminals are treated with lead free solder (ingredient : Sn-Cu) plating.
1. VUFS
2. VUFB
3. VP1
4. UP
5. VVFS
6. VVFB
7. VP1
8. VP
9. VWFS
10. VWFB
11. VP1
12. VPC
13. WP
14. VN1
15. VNC
16. CIN
17. CFO
18. FO
19. UN
20. VN
21. WN
22. P
23. U
24. V
25. W
26. NU
27. NV
28. NW
May 2005