CM600DU-5F Datasheet, PDF (4/4 Pages) Powerex Power Semiconductors – Dual IGBTMOD 600 Amperes/1200 Volts

MAXIMUM RATINGS (Tj = 25°C)
Symbol
Parameter
VCES
Collector-emitter voltage
VGES
Gate-emitter voltage
IC
IC(rms)
Collector current
ICM
IE (Note 1)
IE(rms) (Note 1) Emitter current
IEM (Note 1)
PC (Note 3) Maximum collector dissipation
Tj
Junction temperature
Tstg
Storage temperature
Viso
Isolation voltage
— Mounting torque
—
Weight
G-E Short
C-E Short
TC = 25°C
Pulse
TC = 25°C
Pulse
TC = 25°C
Conditions
Main terminal to base plate, AC 1 min.
Main Terminal M6
Mounting holes M6
Typical value
MITSUBISHI IGBT MODULES
CM600DU-5F
HIGH POWER SWITCHING USE
(Note 2)
(Note 2)
Ratings
250
±20
600
350
1200
600
350
1200
1100
–40 ~ +150
–40 ~ +125
2500
3.5 ~ 4.5
3.5 ~ 4.5
580
Unit
V
V
A
A(rms)
A
A
A(rms)
A
W
°C
°C
V
N•m
N•m
g
ELECTRICAL CHARACTERISTICS (Tj = 25°C)
Symbol
Parameter
ICES
Collector cutoff current
Test conditions
VCE = VCES, VGE = 0V
Limits
Min.
Typ.
—
—
VGE(th) Gate-emitter threshold voltage IC = 60mA, VCE = 10V
3.0
4.0
IGES
Gate leakage current
VGE = VCES, VCE = 0V
—
Tj = 25°C
—
VCE(sat) Collector to emitter saturation voltage _{Tj = 125°C}
IC = 600A, VGE = 10V
—
Cies
Input capacitance
—
Coes
Output capacitance
VCE = 10V
—
Cres
Reverse transfer capacitance ^{VGE = 0V}
—
QG
Total gate charge
VCC = 100V, IC = 600A, VGE = 10V
—
td(on)
Turn-on delay time
—
tr
Turn-on rise time
VCC = 100V, IC = 600A
—
td(off)
Turn-off delay time
VGE1 = VGE2 = 10V
—
tf
Turn-off fall time
RG = 4.2Ω, Inductive load switching operation
—
trr (Note 1) Reverse recovery time
IE = 600A
—
Qrr (Note 1) Reverse recovery charge
—
VEC(Note 1) Emitter-collector voltage
IE = 600A, VGE = 0V
—
Rth(j-c)Q
Rth(j-c)R
Thermal resistance^*1
IGBT part (1/2 module)
FWDi part (1/2 module)
—
—
Rth(c-f)
Contact thermal resistance
Case to fin, Thermal compoundapplied^*2 (1/2 module)
—
Rth(j-c’)Q Thermal resistance^*3
Tc measured point is just under the chips
—
Note 1. IE, VEC, trr, Qrr and die/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode. (FWDi).
2. Pulse width and repetition rate should be such that the device junction temp. (Tj) does not exceed Tjmax rating.
3. Junction temperature (Tj) should not increase beyond 150°C.
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
*^{1 : Tc measured point is indicated in OUTLINE DRAWING.}
*^{2 : Typical value is measured by using Shin-etsu Silicone “G-746”.}
*^{3 : If you use this value, Rth(f-a) should be measured just under the chips.}
—
1.2
1.1
—
—
—
2200
—
—
—
—
—
20.0
—
—
—
0.02
—
Max.
1
5.0
0.5
1.7
—
170
11
5.7
—
850
600
1100
500
300
—
2
0.11
0.20
—
0.05
Unit
mA
V
µA
V
nF
nC
ns
ns
µC
V
°C/W
Mar. 2002