CM75TX-24S Datasheet, PDF (3/10 Pages) Mitsubishi Electric Semiconductor – HIGH POWER SWITCHING USE INSULATED TYPE

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CM75TX-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
ELECTRICAL CHARACTERISTICS (cont; T _j =25 °C, unless otherwise specified)
NTC THERMISTOR PART
Symbol
Item
Conditions
R₂₅
∆R/R
B_(25/50)
P₂₅
Zero-power resistance
Deviation of resistance
B-constant
Power dissipation
THERMAL RESISTANCE CHARACTERISTICS
Symbol
Item
T_C=25 °C ^(Note4)
R₁₀₀=493 Ω, T_C=100 °C ^(Note4)
Approximate by equation ^(Note7)
T_C=25 °C ^(Note4)
Conditions
R_th(j-c)Q
R_th(j-c)D
R_th(c-s)
Thermal resistance ^(Note4)
Contact thermal resistance ^(Note4)
Junction to case, per Inverter IGBT
Junction to case, per Inverter FWDi
Case to heat sink, per 1 module,
Thermal grease applied ^(Note7)
Limits
Min.
Typ.
Max.
4.85
5.00
5.15
-7.3
-
+7.8
-
3375
-
-
-
10
Limits
Min.
Typ.
Max.
-
-
0.25
-
-
0.40
-
15
-
MECHANICAL CHARACTERISTICS
Symbol
Item
M_s
Mounting torque
d_s
Creepage distance
d_a
Clearance
m
Weight
e_c
Flatness of base plate
Conditions
Mounting to heat sink
Terminal to terminal
Terminal to base plate
Terminal to terminal
Terminal to base plate
-
On the centerline X, Y
(Note8)
M 5 screw
Min.
2.5
10.28
14.27
10.28
12.33
-
±0
Limits
Typ.
3.0
-
-
-
-
300
-
Max.
3.5
-
-
-
-
-
+100
Note1. Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).
2. Junction temperature (T _j ) should not increase beyond T _{j m a x} rating.
3. Pulse width and repetition rate should be such that the device junction temperature (T _j ) dose not exceed T _{j m a x} rating.
4. Case temperature (T_C) and heat sink temperature (T _s ) are defined on the each surface (mounting side) of base plate and heat sink
just under the chips. Refer to the figure of chip location.
5. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Refer to the figure of test circuit.
6. B_{(25 / 50)}

ln(
R ₂₅
R₅₀
)
/(
1
T₂₅

1
T₅₀
)
,
R₂₅: resistance at absolute temperature T₂₅ [K]; T₂₅=25 [°C]+273.15=298.15 [K]
R₅₀: resistance at absolute temperature T₅₀ [K]; T₅₀=50 [°C]+273.15=323.15 [K]
7. Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K).
8. The base plate (mounting side) flatness measurement points (X, Y) are as follows of the following figure.
Unit
kΩ
%
K
mW
Unit
K/W
K/kW
Unit
N·m
mm
mm
g
μm
mounting side
Y
X
mounting side
-:Concave
mounting side
+:Convex
9. Use the following screws when mounting the printed circuit board (PCB) on the stand offs.
"ST2.6×10 or ST2.6×12 self tapping screw"
The length of the screw depends on the thickness of the PCB.
Publication Date : September 2012
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