PS21961-4 Datasheet, PDF (2/10 Pages) Mitsubishi Electric Semiconductor – Dual-In-Line Package Intelligent Power Module

MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21961-4/-4A/-4C/-4W
TRANSFER-MOLD TYPE
INSULATED TYPE
Fig. 2 LONG TERMINAL TYPE PACKAGE OUTLINES (PS21961-4A)
A
B
38 ±0.5
20×1.778(=35.56)
0.28
35 ±0.3
1.778 ±0.2
16-0.5
17
1
3.5
1.5 ±0.05
2-R1.6
QR
Type name
Code _{Lot No.}
0.8
3 MIN
18
0.28
2.54 ±0.2
0.5
14×2.54 (=35.56)
25
8-0.6
4-C1.2
0.5
0.5
0.5
2.5 MIN
(2.656)
HEAT SINK SIDE
Dimensions in mm
TERMINAL CODE
1. NC
2. VUFB
3. VVFB
4. VWFB
5. UP
6. VP
7. WP
8. VP1
9. VNC *
10. UN
11. VN
12. WN
13. VN1
14. FO
15. CIN
16. VNC *
17. NC
18. NC
19. NC
20. N
21. W
22. V
23. U
24. P
25. NC
1.5 _MIN
(1.2)
(2.756)
HEAT SINK SIDE
DETAIL A
DETAIL B
*) Two VNC terminals (9 & 16 pin) are connected inside DIP-IPM, please connect either one to the 15V power supply GND outside and
leave another one open.
Fig. 3 ZIGZAG TERMINAL TYPE PACKAGE OUTLINES (PS21961-4C)
A
B
38 ±0.5
20×1.778(=35.56)
0.28
1.778 ±0.2
35 ±0.3
16-0.5
17
1
3.5
1.5 ±0.05
2-R1.6
QR
Type name
Code _{Lot No.}
0.8
3 MIN
18
0.28
2.54 ±0.2
0.5
25
8-0.6
4-C1.2
14×2.54 (=35.56)
0.5
0.5
(2.656)
HEAT SINK SIDE
Dimensions in mm
TERMINAL CODE
1. NC
2. VUFB
3. VVFB
4. VWFB
5. UP
6. VP
7. WP
8. VP1
9. VNC *
10. UN
11. VN
12. WN
13. VN1
14. FO
15. CIN
16. VNC *
17. NC
18. NC
19. NC
20. N
21. W
22. V
23. U
24. P
25. NC
1.5 _MIN
(1.2)
HEAT SINK SIDE
(2.756)
DETAIL A
DETAIL B
*) Two VNC terminals (9 & 16 pin) are connected inside DIP-IPM, please connect either one to the 15V power supply GND outside and
leave another one open.
Sep. 2007
2