B1005-BD_08 Datasheet, PDF (9/12 Pages) Mimix Broadband – 35.0-45.0 GHz GaAs MMIC

35.0-45.0 GHz GaAs MMIC
Buffer Amplifier
October 2008 - Rev 02-Oct-08
Mechanical Drawing
1.300
(0.051)
1.113 1.514 1.715
(0.044) (0.060) (0.067)
2
34
B1005-BD
0.699
1
(0.028)
5
0.577
(0.023)
0.0
0.0
8
76
0.655 1.054 ^1.255
(0.026) (0.042) ^(0.049)
2.400
(0.095)
(Note: Engineering designator is 40LN3UA0063)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.931 mg.
Bond Pad #1 (RF In)
Bond Pad #3 (Vd2)
Bond Pad #5 (RF Out)
Bond Pad #7 (Vg2)
Bond Pad #2 (Vd1)
Bond Pad #4 (Vd3)
Bond Pad #6 (Vg3)
Bond Pad #8 (Vg1)
Bias Arrangement
2
34
Vd1,2,3
Bypass Capacitors - See App Note [2]
Vd1,2,3
RF In 1
5 RF Out
RF In
RF Out
8
76
Vg1,2,3
Vg1,2,3
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 9 of 12
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
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