XP1073-BD Datasheet, PDF (7/10 Pages) Mimix Broadband – 34.0-37.0 GHz GaAs MMIC Power Amplifier

34.0-37.0 GHz GaAs MMIC
Power Amplifier
February 2010 - Rev 16-Feb-10
Mechanical Drawing
6.300
(0.248)
0.498 1.299 2.073
3.069
(0.020) (0.051) (0.082) (0.121)
0.898 1.662
2.618 3.468
(0.035) (0.065) (0.103) (0.137)
2 3 45 6
7 89
P1073-BD
2.779
(0.109)
1
XP1073-BD
3.490
10
(0.137)
0.0
18 17 16 15 14 13 12 11
0.499 1.299 2.073
3.069
0.0 (0.020) (0.051) (0.082) (0.121)
0.898 1.662
2.618 3.468
(0.035) (0.065) (0.103) (0.137)
4.500
(0.177)
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (Vg4A)
Bond Pad #9 (Vd4A)
Bond Pad #10 (RFout)
Bond Pad #11 (Vd4B)
Bond Pad #12 (Vg4B)
Bond Pad #13 (Vd3B)
Bond Pad #14 (Vg3B)
Bond Pad #15 (Vd2B)
Bond Pad #16 (Vg2B)
Bond Pad #17 (Vd1B)
Bond Pad #18 (Vg1B)
Units: millimeters Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
Most DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF and Vd3,4 Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 17.577 mg
Bias Arrangement (See App Notes [1], [2] and [3])
Vg1 Vg2 Vg3 Vd3 Vg4 Vd4
2 3 45 6
7 89
XP1073-BD
RF In 1
10 RF Out
18 17 16 15 14 13 12 11
Vd1 Vd2 Vg3 Vd3 Vg4 Vd4
Layout for reference only – It is recommended to bias output stage
from both sides.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 7 of 10
Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.