MYXN25Q256A13ESF Datasheet, PDF (1/31 Pages) Micross Components – SPI-compatible serial bus interface

Serial NOR Flash Memory
MYXN25Q256A13ESF*
*Advanced information. Subject to change without notice.
256Mb, 3V, Multiple I/O, 4KB Sector Erase
Features
• SPI-compatible serial bus interface
• Double transfer rate (DTR) mode
• 2.7–3.6V single supply voltage
• 108 MHz (MAX) clock frequency supported for all
protocols in single transfer rate (STR) mode
• 54 MHz (MAX) clock frequency supported for all protocols
in DTR mode
• Dual/quad I/O instruction provides increased throughput
up to 54 MB/s
• Supported protocols
ƒƒ Extended SPI, dual I/O, and quad I/O
ƒƒ DTR mode supported on all
• Execute-in-place (XIP) mode for all three protocols
ƒƒ Configurable via volatile or nonvolatile registers
ƒƒ Enables memory to work in XIP mode directly after
power-on
• PROGRAM/ERASE SUSPEND operations
• Continuous read of entire memory via a single command
ƒƒ Fast read
ƒƒ Quad or dual output fast read
ƒƒ Quad or dual I/O fast read
• Flexible to fit application
ƒƒ Configurable number of dummy cycles
ƒƒ Output buffer configurable
• Software reset
• 3-byte and 4-byte addressability mode supported
• 64-byte, user-lockable, one-time programmable (OTP)
dedicated area
• Erase capability
ƒƒ Subsector erase 4KB uniform granularity blocks
ƒƒ Sector erase 64KB uniform granularity blocks
ƒƒ Full-chip erase
• Write protection
ƒƒ Software write protection applicable to every 64KB
sector via volatile lock bit
ƒƒ Hardware write protection: protected area size
defined by five nonvolatile bits (BP0, BP1, BP2, BP3,
and TB)
ƒƒ Additional smart protections, available upon request
• Electronic signature
ƒƒ JEDEC-standard 2-byte signature (BA19h)
ƒƒ Unique ID of 17 read-only bytes including:
additional extended device ID (EDID) to identify
device factory options; customized factory data
• Minimum 100,000 ERASE cycles per sector
• More than 20 years data retention
OptionsCode
• Packages: TSOPII
DG
ƒƒ SOP2-16/300milsSF
• Temperature Ranges
ƒƒ Military (-55°C to +125°C)
XT
• Part Marking: Label (L), Dot (D)
MYXN25Q256A13ESF*
Revision 1.2 - 04/4/2016
1
Form #: CSI-D-685 Document 016