ARF477FL Datasheet, PDF (4/4 Pages) Microsemi Corporation – RF POWER MOSFET N-CHANNEL PUSH - PULL PAIR

65MHz Test Circuit
ARF477FL
.125R
4 pls
1.000
.325 +/- .010
.080
.125dia
4 pls
ARF477FL
.570
.320
1.250
.175
.175
1.500
.325
.200
.300
.005 .040
Thermal Considerations and Package Mounting:
The rated power dissipation is only available when the package
mounting surface is at 25°C and the junction temperature is 175°C.
The thermal resistance between junctions and case mounting sur-
face is 0.23 °C/W. When installed, an additional thermal impe-
dance of 0.07°C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and
flat. Thermal joint compound must be used to reduce the effects of
small surface irregularities. Use the minimum amount necessary to
coat the surface. The heatsink should incorporate a copper heat
spreader to obtain best results.
The package design clamps the ceramic base to the heatsink. A
clamped joint maintains the required mounting pressure while al-
lowing for thermal expansion of both the base and the heat sink.
Four 4-40 (M3) screws provide the required mounting force. T = 6
in-lb (0.68 N-m).
HAZARDOUS MATERIAL WARNING
The white ceramic portion of the device between leads
and mounting surface is beryllium oxide, BeO. Beryllium
oxide dust is toxic when inhaled. Care must be taken dur-
ing handling and mounting to avoid damage to this area.
These devices must never be thrown away with general
industrial or domestic waste.
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. US and Foreign patents pending. All Rights Reserved.