MT9V135C12STC Datasheet, PDF (16/17 Pages) Micron Technology – 1/4-Inch System-On-A-Chip (SOC) VGA NTSC/PAL CMOS Digital Image Sensor

Preliminary
MT9V135: SOC VGA Digital Image Sensor
Package Diagram
Package Diagram
Figure 10: 48-Pin CLCC Package Outline Drawing
D
2.3 ±0.2
Seating
plane
A
47X
1.0 ±0.2
48X
0.40 ±0.05
8.8
4.4
0.8
TYP
48 1
8.8
4.4
4X
0.2
5.215
11.43
5.715
Lead finish:
Au plating, 0.50 microns
minimum thickness
over Ni plating, 1.27 microns
minimum thickness
1.7
48X R 0.15
1.75
5.215
4.84
11.43
5.715
0.8 TYP
C
A
B
0.05
1.400 ±0.125
0.90
for reference only
0.35
for reference only
Substrate material: alumina ceramic 0.7 thickness
Wall material: alumina ceramic
Lid material: borosilicate glass 0.55 thickness
H CTR
Ø0.20 A B C
First
clear
pixel
V CTR
Ø0.20 A B C
10.9 ±0.1
CTR
Image
sensor die:
0.675 thickness
Optical
area
0.10 A
Optical area:
10.9 ±0.1
CTR
Optical
center¹
Maximum rotation of optical area relative to package edges: 1º
Maximum tilt of optical area relative to
seating plane A : 50 microns
Maximum tilt of optical area relative to
top of cover glass D : 100 microns
Notes: 1. Optical center = package center.
2. All dimensions are in millimeters.
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Preliminary: This data sheet contains initial characterization limits that are subject to change upon full characterization of
production devices.
PDF: 09005aef82c99cd/Source:09005aef824c99db
MT9V135_LDS_3.fm - Rev. B 3/07 EN
16
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