MT9M111 Datasheet, PDF (1/61 Pages) Micron Technology – 1/3-INCH SOC MEGAPIXEL CMOS DIGITAL IMAGE SENSOR

PRELIMINARY^‡
MT9M111
SOC MEGAPIXEL DIGITAL IMAGE SENSOR
1/3-INCH SOC MEGAPIXEL
CMOS DIGITAL IMAGE
SENSOR
MT9M111I29STC
(Micron Part Number)
Features
• DigitalClarity CMOS Imaging Technology
• System-on-a-Chip (SOC)—Completely integrated
camera system
• Ultra-low power, low cost, progressive scan CMOS
image sensor
• Superior low-light performance
• On-chip image flow processor (IFP) performs
sophisticated processing:
Color recovery and correction
Sharpening, gamma, lens-shading correction
On-the-fly defect correction
• Filtered image downscaling to arbitrary size with
smooth, continuous zoom and pan
• Automatic Features:
Auto exposure, auto white balance (AWB), auto
black reference (ABR), auto flicker avoidance, auto
color saturation, auto defect identification and
correction
• Fully automatic Xenon and LED-type flash support
Fast exposure adaptation
• Multiple parameter contexts
Easy/fast mode switching
• Camera control sequencer automates:
Snapshots
Snapshots with flash
Video clips
• Simple two-wire serial programming interface
• ITU-R BT.656 (YCbCr), 565RGB, 555RGB, or 444RGB
formats (progressive scan)
• Raw and processed Bayer formats
• Output FIFO and integer clock divider:
“Uniform” pixel clocking
Applications
• Cellular phones
• PDAs
• Toys
• Other battery-powered products
Table 1: Key Performance Parameters
PARAMETER
Optical Format
Active Imager Size
Active Pixels
Pixel Size
Color Filter Array
Shutter Type
Maximum Data Rate/
Maximum Master Clock
Frame
Rate
SXGA
(1,280 x 1,024)
QSXGA
(640 x 512)
ADC Resolution
Responsivity
Dynamic Range
SNR_MAX
Supply
Voltage
I/O Digital
Core Digital
Analog
Power Consumption
Operating Temperature
Packaging
TYPICAL VALUE
1/3-inch (5:4)
4.6mm(H) x 3.7mm (V),
5.9mm diagonal
1,280H x 1,024V
3.6µm x 3.6µm
RGB Bayer Pattern
Electronic Rolling Shutter
(ERS)
27 MPS/54 MHz
15 fps at 54 MHz
30 fps at 54 MHz
10 bit, dual on-chip
1.0 V/lux-sec (550nm)
71dB
44dB
1.7V–3.6V
2.5V–3.1V
2.5V–3.1V
170mW SXGA at 15 fps
(54 MHz CLKIN)
90mW QSXGA at 30 fps
(54 MHz low-power
mode)
-30°C to +70°C
44-Ball iCSP
wafer or die
09005aef8136743e pdf/09005aef8136761e zip
MT9M111__SOC1310__1.fm - Rev. C 10/04 EN
1
©2004 Micron Technology, Inc. All rights reserved.
‡_{PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY}
MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.