MT36HTJ51272-P Datasheet, PDF (1/14 Pages) Micron Technology – DDR2 SDRAM Registered DIMM (RDIMM)

4GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM
Features
DDR2 SDRAM Registered DIMM (RDIMM)
MT36HTJ51272(P) – 4GB
For the latest data sheet and for component data sheets, refer to Micron's Web site: www.micron.com
Features
• Supports 95°C with double refresh
• 240-pin, registered dual in-line memory module
• Fast data transfer rates: PC2-3200, PC2-4200, or
PC2-5300
• Supports ECC error detection and correction
• VDD = VDDQ = +1.8V
• VDDSPD = +1.7V to +3.6V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4-bit prefetch architecture
• DLL to align DQ and DQS transitions with CK
• Dual rank
• Multiple internal device banks for concurrent
operation
• Programmable CAS# latency (CL)
• Posted CAS# additive latency (AL)
• WRITE latency = READ latency - 1 ^tCK
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8,192-cycle refresh
• On-die termination (ODT)
• Serial presence-detect (SPD) with EEPROM
• Gold edge contacts
Figure 1: 240-Pin DIMM (MO-237 R/C “K”)
Height: 30mm (1.18in)
Options
Marking
• Parity
• Package
240-pin DIMM (lead-free)
• Frequency/CAS latency¹
3.0ns @ CL = 5 (DDR2-667)²
3.75ns @ CL = 4 (DDR2-533)
5.0ns @ CL = 3 (DDR2-400)
• PCB height
30mm (1.18in)
P
Y
-667
-53E
-40E
Notes: 1. CL = CAS (READ) latency; registered mode
will add one clock cycle to CL.
2. Contact Micron for product availability.
Table 1: Key Timing Parameters
Speed
Data Rate (MT/s)
t_RCD
t_RP
t_RC
Grade
Industry Nomenclature
CL = 5
CL = 4
CL = 3
(ns)
(ns)
(ns)
-667
-53E
-40E
PC2-5300
PC2-4200
PC2-3200
667
533
400
15
15
55
–
533
400
15
15
55
–
400
400
15
15
55
Table 2: Addressing
Refresh count
Row address
Device bank address
Device page size per bank
Device configuration
Column address
Module rank address
4GB
8K
16K (A0–A13)
8 (BA0–BA2)
1KB
1Gb (256 Meg x 4)
2K (A0–A9, A11)
2 (S0#, S1#)
PDF: 09005aef822553c2/Source: 09005aef822553af
HT36HTJ51272.fm - Rev. B 7/06 EN
1
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©2003 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.