SST89E516RD2_13 Datasheet, PDF (93/94 Pages) Microchip Technology – FlashFlex MCU

FlashFlex MCU
SST89E516RD2 / SST89E516RD
SST89V516RD2 / SST89V516RD
Pin #1
44
Identifier
1
34
33
10.00 ± 0.10
12.00 ± 0.25
.30
.45
.80 BSC
Data Sheet
11
23
1.2
max.
Note:
12
22
10.00 ± 0.10
12.00 ± 0.25
.09
.20
.95
1.05
.05
.45
.15
.75
0°- 7°
1.00 ref
1. Complies with JEDEC publication 95 MS-026 ACB dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±0.05) mm.
44-tqfp-TQJ-7
4. Package body dimensions do not include mold flash. Maximum allowable mold flash is .25mm.
1mm
Figure 50:44-lead Thin Quad Flat Pack (TQFP)
SST Package Code: TQJ
©2013 Silicon Storage Technology, Inc.
93
DS25093B
02/13