TC1264_06 Datasheet, PDF (9/18 Pages) Microchip Technology – 800 mA Fixed-Output CMOS LDO with Shutdown

TC1264
3-Lead Plastic (EB) (DDPAK)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
L3
E1
D2
D
D1
1
b
e
TOP VIEW
b1
BOTTOM VIEW
α
(5X)
A
c2
φ
A1
c
L
Units
Dimension Limits
Number of Pins
Pitch
e
Overall Height
A
Standoff
§
A1
Overall Width
E
Exposed Pad Width
E1
Molded Package Length
D
Overall Length
D1
Exposed Pad Length
D2
Lead Thickness
c
Pad Thickness
c2
Lower Lead Width
b
Upper Lead Width
b1
Foot Length
L
Pad Length
L3
Foot Angle
φ
Mold Draft Angle
α
INCHES*
MIN
NOM
3
1.00 BSC
.170
.177
.000
.005
.385
.398
.256 REF
.330
.350
.549
.577
.303 REF
.014
.020
.045
--
.026
.032
.049
.050
.068
--
.045
--
--
--
3°
--
MAX
.183
.010
.410
.370
.605
.026
.055
.037
.051
.110
.067
8°
7°
MILLIMETERS
MIN
NOM
3
2.54 BSC
4.32
4.50
0.00
0.13
9.78
10.11
6.50 REF
8.38
8.89
13.94
14.66
7.70 REF
0.36
0.51
1.14
--
0.66
0.81
1.24
1.27
1.73
--
1.14
--
--
--
3°
--
MAX
4.65
0.25
10.41
9.40
15.37
0.66
1.40
0.94
1.30
2.79
1.70
8°
7°
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically, exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: TO-252
Revised 07-19-05
Drawing No. C04-011
© 2006 Microchip Technology Inc.
DS21375C-page 9